Bechtel has confirmed it has been chosen to complete Phase 1 of a $20 billion Intel semiconductor facility in Licking County, Ohio which will create thousands of jobs.
The excavation phase of the Intel Ohio project, which consists of two semiconductor facilities, began in September.
In January, Intel announced the Ohio Project, a huge bet on the future of semiconductor manufacturing in the United States.
The complex will cover nearly 1,000 acres and will eventually house up to eight semiconductor factories.
According to Intel, production will begin in 2025.
According to Jackie Sturm, Intel’s corporate vice president of global supply chain operations, the project is the company’s largest construction project to date.
Bechtel’s involvement in Phase 1 will entail designing and constructing a facility totaling 2.5 million square feet.
This includes 600,000 square feet of cleanrooms, which are highly monitored rooms that control for outside forces like dust, temperature, and other factors that can disrupt or destroy semiconductors during the manufacturing process.
Bechtel will partner with the North American Building Trades Unions and suppliers to create new construction jobs and work with local education organizations to implement training programs.
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In a statement, Bechtel praised the passage of both the $1.2 trillion Infrastructure Investment and Jobs Act and the $52 billion CHIPS Act.
Previously, Intel delayed the Ohio facility’s groundbreaking to pressure lawmakers into passing the bill.
Catherine Hunt Ryan, president of Bechtel’s manufacturing and technology business said: “We are honored to be chosen by Intel as its partner and we are ready to build their most advanced semiconductor facilities in the world.”
Bechtel’s contract value was not disclosed, and the company did not respond to an email inquiry about the contract by the publication deadline.
Source: Construction Dive